OUR PRODUCTS:
Special Service
• Reduction Wafer Size
• Edge Grinding
• Sand Blasting (strip surface coating).
Silicon Wafers
Prime,Monitor,Test
CZ and FZ
All Diameters: 1” through 300mm:
Single- or Double Side Polished
as cut, Lapped, Etched
Orientation: <100><111><110>
Double Side Polish: 1” through 200mm:
Ultra Flat <1µm TTV
for 100mm to 200mm
SOI, MEMS, Optics
Precission of thickness ±5µm
Ultra Thin Thickness: 50 µm - 5000µm
SOI Wafers
Silicon on Insulator
Thick Film
Fusion Bonding
Diameters: 3” through 200mm:
Single- or Double Side Polished
CZ and FZ
Device Layer: Flatness <1µm <2µm <5µm
Thickness <=5µm, 10µm to 300µm up
Buried Thermal Oxide: 0,2µm to 2,4µm
Handle: Flatness <1µm up>
Any Typ, Orientation, Res.
Thickness: 300µm to 2000µm
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